Overview

GMMCO offers a wide variety of secondary processes, including some performed in house and others that are outsourced to outside sources. Our access to these types of secondary processes is a large factor in our ability to produce parts for numerous different markets and applications.

Internal Secondary Processes

  • Bag+Tag Packaging

  • Deburring

    • Flats, Small Holes, Slots

  • Low-Stress Part Marking (Scribe / Engraver)

  • Polishing Operations

  • Secondary Milling Operations (see Milling section)

    • Flats, Small Holes, Slots, Threading, Drilling

Polishing operation performed on Haas TL-1 Tool Room Lathe

Milling

Haas TM-1 Tool Room Mill

GMMCO’s facility houses 2 Haas Tool Room Mills.  Although our y-axis, dual spindle turning centers usually can machine parts complete, there are some cases in which parts with unique features must have a secondary operation set up on the Mill.  GMMCO builds custom vises, fixtures, and jaws for milling operations in order to machine a variety of different unique features, including flats, small holes, slots, cross-holes, special threading, and more.

Outside Processing

While GMMCO does not perform every secondary process to parts in house, we maintain strong relationships with a wide array of excellent outside processing suppliers.  GMMCO only uses top-notch suppliers that must pass our high quality standards and approval procedure.  Additionally, all parts that require outside processes undergo a vigorous Receiving Inspection process performed by our quality team upon their return to GMMCO’s shop.  These strong connections with our trusted and vast supplier network allow us to safely and securely send parts out for any further operations they may require beyond machining (e.g. Heat Treating or Plating).

GMMCO posses the following secondary process capabilities through the use of outside sources:

  • Anodizing

  • Blackening

  • Dynamic Balancing

  • Fluorescent Penetrant Inspection (FPI)

  • Grinding and Honing (ID & OD)

  • Heat Treating

  • Laser Part Marking

  • Magnetic Particle Inspection (MPI)

  • Passivation

  • Plasma Coating

  • Plating

    • Cadmium, Copper, Silver, Zinc

  • Wire EDM (slots and small holes)